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Acknowledgement

This project is funded by the Innovation and Technology Fund (ITF) and supported by The Hong Kong Research Institute of Textiles and Apparel (HKRITA). Also, we would like to express our thanks to the following parties (according to the alphabetic order):

Co-applicant and Collaborating Organizations

Association for Computing Machinery
The Hong Kong Society of Dyers & Colourists

 

Sponsoring Organizations
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